LED developer and manufacturer Luminus Devices, headquartered in Boston, Massachusetts, announced their latest innovation in LED packaging technology at InfoComm 2012, held June 8-12 in Las Vegas, Nevada. Utilizing proprietary processes coupled with specialty materials and equipment, Luminus has achieved a 30% reduction in thermal resistance in their Big Chip LED products. The reduced thermal resistance enables the LED to achieve up to 20% higher brightness levels while maintaining Luminus’ current reliability. The new packaging also allows projector and optical engine makers to engineer smaller form factors. At InfoComm, Luminus demonstrated the capabilities of the new packaging with a retrofitted Samsung SP‑F10M projector. The projector originally produced 1,000 lumens using Luminus LED illumination. With the new thermal resistance modifications, plus improvements Luminus has achieved since the projector’s introduction more than two years ago, the modified projector now produces 1,500 lumens. Samples of Luminus products based on the new packaging technology are available now, with production quantities coming in 2012Q4.
PMA’s projector market research has followed the ongoing improvements in LED technology over the past several years, enabling the introduction of ever brighter pico and personal models.