IC manufacturer Intersil and MOEMS imager maker MicroVision have announced an agreement to develop application specific integrated chipsets (ASICs) for MicroVision’s second generation high definition (HD) PicoP display technology. The two companies will collaborate to integrate advanced features such as virtual touch and proximity sensing, increase brightness, reduce power consumption, reduce component size and lower the cost of the overall solution. The partnership with MicroVision represents the latest in Intersil’s commitments to the New Era projector market. In May of this year, Intersil announced the Pico-qHD chipset and a reference design using the Micron E330 LCOS optical engine.

PMA’s ongoing projector market research has been following the recent entry into the New Era market by IC makers, as illustrated by the recent acquisition of Israeli MOEMS developer bTendo by STMicroelectronics.

MicroVision

Intersil